A one-stop solution using NXP's high-performance crossover MCU and 3D camera can achieve faster and safe face recognition under harsh lighting conditions.
A one-stop solution using NXP's high-performance crossover MCU and 3D camera can achieve faster and safe face recognition under harsh lighting conditions.
NXP Semiconductors announced the expansion of its EdgeReady solution product portfolio, adding a new security face recognition solution using high-performance 3D structured light module (SLM) cameras and i.MX RT117F crossover MCU. This is the first solution to achieve 3D face recognition and security at the edge through the combination of a 3D SLM camera and MCU, without the need for expensive and power-consuming Linux configuration required for using traditional high-performance 3D cameras on the MPU.
Product performance advantage
Using the latest EdgeReady solution, developers of smart locks and other access control systems can quickly and easily add machine learning-based secure face recognition to smart home and smart building products. The solution can provide reliable 3D face recognition for indoor and outdoor applications, suitable for various lighting conditions, including bright sunlight, dim night lights or other harsh lighting that is challenging for traditional face recognition systems condition.
The use of a 3D SLM camera enables advanced life detection, which helps distinguish between real people and illusions of deceptive technology (such as photos, simulated masks or 3D models) and prevent unauthorized access.
i.MX RT117F uses advanced machine learning models as an integral part of NXP's eIQ machine learning software, running on its high-performance CPU core, which can perform face recognition faster and more accurately, improving user experience and energy efficiency.
Similar to NXP's i.MX RT106F MCU EdgeReady solution for secure face recognition, advanced life body detection and face recognition are done at the local edge, and personal biometric data can be retained on the device. This feature can reduce consumer privacy concerns while eliminating the latency issues associated with cloud-based solutions.
Product pricing and time to market
NXP and authorized distributors will release the development kit SLN-VIZN3D-IOT for this 3D face recognition solution in late November. The suggested retail price is $299 (USD).
As part of the i.MX RT1170 series of crossover MCUs, the i.MX RT117F MCU is based on the Arm Cortex-M7 CPU, has 2 MB on-chip SRAM, and runs at a frequency of up to 1 GHz. i.MX RT117F includes a license to use NXP's 3D face recognition software development kit (SDK) to support consumer electronics, industrial and automotive temperature-level applications. The suggested retail unit price is $7.02 (USD), with a starting price of 10,000 pieces.
3D face recognition development kit based on crossover MCU
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Introduction to related technical resources
EdgeReady solution
The NXP EdgeReady solution brings the advantages of edge computing intelligence to your application. Each platform includes hardware optimized for cost and form factor, ready to be used at the edge, and equipped with fully integrated stand-alone software that has been fully tested and certified by NXP.
To learn more about EdgeReady solutions, please click here >>
i.MX RT series crossover MCU
The i.MX RT series of cross-border MCUs can take into account both high performance and integration, while minimizing costs to meet the requirements of today's edge node applications for high-performance embedded processors. This series provides advanced microcontrollers (MCUs) with application processor functions at low cost, enabling millions of networked edge devices to achieve advanced computing and machine learning capabilities.
